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| 2.0x1.25mm SMD CHIP LED LAMP APTK2012MGC MEGA GREEN Features 2.0mmx1.25mm SMT LED, 0.75mm THICKNESS. LOW POWER CONSUMPTION. WIDE VIEWING ANGLE. IDEAL FOR BACK LIGHT AND INDICATOR. VARIOUS COLORS AND LENS TYPES AVAILABLE. PACKAGE:2000PCS/REEL Description The Mega Green source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1121 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 1 OF 4 ERP:1204000313 Selection Guide Part No. Dice Lens Type Iv (mcd) @ 20mA Min. APTK2012MGC MEGA GREEN (InGaAlP) WATER CLEAR 36 Typ. 80 Viewing Angle 21/2 100 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Symbol peak D 1/2 C VF IR Parameter Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Device Mega Green Mega Green Mega Green Mega Green Mega Green Mega Green Typ. 574 568 26 20 2.1 2.5 10 Max. Units nm nm nm pF V uA Test Conditions IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA VR = 5V Absolute Maximum Ratings at TA=25C Parameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Mega Green 105 30 150 5 -40C To +85C Units mW mA mA V SPEC NO: DSAD1121 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 2 OF 4 ERP:1204000313 Mega Green APTK2012MGC SPEC NO: DSAD1121 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 3 OF 4 ERP:1204000313 APTK2012MGC APTK2012MGC SMT Reflow Soldering Instructions SMT Reflow Soldering Instructions Number of reflow process shall be 2be less than and cooling cooling Number of reflow process shall times or less 2 times and processto normal temperature is required between first and process to normal temperature is required between first and second soldering process. second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1121 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 4 OF 4 ERP:1204000313 |
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